Assembly Engineer_BST

Job Description

Create something new

You will industrialize new manufacturing processes for consumer electronics products and transfer them from development into high-volume production. In this role, you actively shape the setup of new supply chains and manufacturing models, including new technology areas such as acoustics or optics.

Assume responsibility

You are responsible for the overall coordination of external assembly suppliers in Asia and act as the primary technical and operational point of contact for all assembly-related topics. You serve as the first escalation point for supplier-related issues (from and towards OSATs) and ensure timely resolution on all levels.

Technical Leadership

You lead and develop the local assembly team by:

• Providing technical consultation and guidance on complex packaging and assembly topics
• Coaching and supporting team members in problem-solving and technical decision-making
• Driving competence development and fostering a high-performance team environment
• Acting as a sparring partner for critical technical challenges in mass production and NPI

International Team & Interface Management

You coordinate cross-functional and international teams and act as the key interface between internal stakeholders and external partners. You represent BST Operations towards suppliers and customers in Asia, including:

• Leading supplier interactions, audits, and escalation discussions
• Acting as local management representative during customer visits
• Ensuring alignment between internal requirements and supplier capabilities

Holistic approach (Quality, Cost, Delivery)

Together with suppliers, you drive improvements to achieve quality, cost, and delivery targets in high-volume production. This includes:

• Managing supplier-related improvement initiatives and escalations
• Challenging interfaces to ensure balanced decision-making (e.g., PCN, RMA topics)
• Supporting stability and yield improvement in production
• Ensuring structured problem-solving and sustainable corrective actions

Help shape the future

You lead strategic and operational initiatives to optimize complex manufacturing processes in packaging and interconnect technologies. You:

• Drive NPI readiness and industrialization
• Build and enhance end-to-end manufacturing KPI and analysis systems
• Support new manufacturing concepts and long-term operational strategies

Qualifications

Personality

• Strong communication and leadership skills
• Assertive, solution-oriented, and able to influence stakeholders
• High level of initiative, ownership, and accountability
• Intercultural mindset with willingness to travel

Working style

• Structured, analytical, and independent working approach
• Strong problem-solving mindset with focus on sustainable solutions
• Ability to manage complexity and prioritize effectively in dynamic environments

Experience and Know-how

• Several years (>5–7 years) of experience in semiconductor manufacturing, assembly, or development
• Deep understanding of assembly and packaging technologies
• Strong knowledge of semiconductor manufacturing processes (frontend, wafer test, OSAT, final test)
• Experience in supplier management, escalation handling, and high-volume production environments
• Familiarity with quality and problem-solving methodologies

Languages

• Very good English skills (written and spoken)
• German or additional languages are a plus

Education

• Master’s, Diploma, or PhD degree in engineering (e.g., electrical engineering, materials science, mechanical engineering, physics, or similar)