About OLIX

AI is growing faster than any technology in history, and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has reached its limit. A new paradigm that is faster and more efficient will be the biggest economic opportunity of the next century and create the most important company of the next decade.

The OLIX Decode Accelerator 1 (DX-1) is the first accelerator architected specifically for decode. Rack-scale co-design of logic, data movement, packaging, and ultra-low-loss optics enables a step change in system-level performance.

The Role

As an Optical Interconnect Process Engineer at OLIX, you will be responsible for translating next-generation optical interconnect architectures into scalable, manufacturable, and reliable hardware.

This role focuses on the process integration, fabrication, and packaging of Silicon Nitride Photonic Integrated Circuits (PICs). You will drive the development of low-loss SiN waveguide platforms, wafer-level processing, fiber-to-chip coupling, and production readiness for high-density co-packaged optics (CPO) architectures. You will work hands-on across prototyping, foundry transfer, characterization, and yield, ensuring our SiN-based designs can be built at scale with uncompromising performance.

Responsibilities

Optical Interconnect Implementation

Design and optimize high-density Silicon Nitride waveguide interconnects and routing networks.
Develop advanced coupling solutions, including spot-size converters, grating couplers, and edge-coupling interfaces for efficient fiber-to-SiN PIC connectivity.
Work with SiN-based platform components for multiplexing (WDM), filtering, and signal distribution.
Define alignment strategies and sub-micron tolerances for high-volume automated assembly.

Packaging & Integration

Drive co-packaged optics (CPO) integration utilizing Silicon Nitride platforms at the package and system level.
Address opto-mechanical constraints, managing the interface between high-index-contrast SiN waveguides, fibers, and laser sources.
Partner with mechanical and thermal teams to manage the unique thermal expansion and mechanical stress profiles of integrated SiN-semiconductor systems.

Process Development & Manufacturing

Develop and refine wafer-scale fabrication processes for high-quality, low-loss Silicon Nitride films (including LPCVD/PECVD deposition, CMP, and high-temperature annealing).
Optimize critical etching processes (RIE/ICP) to achieve ultra-smooth waveguide sidewalls and precise phase control.
Apply Design for Manufacturing (DFM) principles tailored to photonic foundry capabilities and limitations.
Partner with commercial semiconductor foundries, OSATs, and contract manufacturers to transfer and scale SiN process flows.

Yield, Reliability & Validation

Analyze film stress, thickness uniformity, and defect density to mitigate cracking and maximize wafer-level yield.
Investigate process variability and resolve production bottlenecks at the foundry level.
Define and execute validation plans for integrated SiN optical assemblies, ensuring long-term reliability and power handling capability.

Skills & Experience

5–15 years of experience in advanced micro-fabrication, with deep process integration expertise specifically in Silicon Photonics or Silicon Nitride platforms.
Proven track record of creating, modifying, or scaling complete process flows for novel optoelectronic or passive photonic devices.
Deep hands-on background in critical SiN fabrication techniques: photolithography, high-aspect-ratio DRIE/RIE, thin-film deposition (LPCVD/PECVD), and Chemical Mechanical Planarization (CMP).
Experienced collaborating with external fabs, R&D consortia (e.g., IMEC, AIM Photonics, CEA-Leti), or tool vendors to develop or transfer new process capabilities.
Comfortable switching between hands-on cleanroom/lab work and high-level process architecture and partner coordination.
Proficient in DOE/SPC tools (JMP, Python, etc.) and disciplined process documentation.
B.Eng./M.Sc./Ph.D. in Materials Science, Electrical Engineering, Physics, or a related field.
Excellent communicator who thrives in fast-moving, interdisciplinary environments.

Nice to Have

Experience with wafer-level bonding (e.g., III-V materials or thin-film Lithium Niobate onto Silicon Nitride).
Familiarity with commercial foundry SiN Photonic Design Kits (PDKs) and multi-project wafer (MPW) runs.
Working knowledge of optical simulation and characterization (such as mode solvers, waveguide propagation loss loops, and spectral testing).

Compensation & Equity

Competitive Salary: Commensurate with your experience, skills, and location
Equity & Ownership: Meaningful stock options. You’re not just joining the mission; you’re owning a piece of it
Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer an annual Living-Local Bonus if your residence is within 20 minutes of the office
Retirement Benefits: Employer-contributed retirement plans to help you build long-term financial security.

Due to U.S. export control regulations, candidates’ eligibility to work at OLIX depends on their most recent citizenship or permanent residency status. We are generally unable to consider applicants whose most recent citizenship or permanent residence is in certain restricted countries (currently including Iran, North Korea, Syria, Cuba, Russia, Belarus, China, Hong Kong, Macau, and Venezuela). Applicants who have subsequently obtained citizenship or permanent residency in another country not subject to these restrictions may still be eligible.

Optical Interconnect Process Engineer