Process TD Engineer

Job Description

• Simulation and Analysis:
  • Perform simulations using ANSYS to predict mechanical behavior
  • Analyze stress, strain, and failures in components and assemblies under environmental and operational conditions.
  • Analyze stress, strain, and failures in SSD rework and disassembly condition

• New Product Introduction (NPI) Development
  • Define and establish SSD manufacturing process flows, procedures, and equipment configurations for electronic modules.
  • Develop and characterize new assembly and rework processes for SSDs across multiple form factors.
  • Select, qualify, and develop materials and equipment to meet manufacturability, reliability, yield, and productivity targets. Create, validate, and document manufacturing recipes and process parameters for High Volume Manufacturing (HVM) transfer.

• Process & Technology Development

• • Develop and implement rework solutions and techniques for SSD modules, including PCBA component replacement and product disassembly. 
  • Continuously explore and validate new rework techniques to support evolving SSD technologies and complex designs. Perform process data analysis, risk assessment (TRA), and implement process controls throughout the Product Life Cycle (PLC).
  • Support design for manufacturability and assembly (DFM/DFA) reviews and provide feedback to product development and cross-functional teams.

• Cross-Functional Collaboration

• • Work closely with design, quality, planning, commercial, and supply chain teams to ensure seamless NPI to HVM transition and production ramp-up. 
  • • Collaborate with ODMs and suppliers to explore and develop advanced manufacturing and rework technologies. Required Skills & Competencies
  • • Strong understanding of electronics product design, system analysis, and manufacturing processes
  • Expertise in component-level manufacturing with a focus on process, materials, and new technique development.
  • • Experience in process development, integration, and continuous improvement.
  • • Proficiency in DFX (Design for Excellence) principles for PCB and mechanical assemblies.
  • • Solid foundation in statistics and data-driven process control.
  • • Excellent problem-solving, communication, and cross-functional collaboration skills.

Qualifications

Education & Experience

• Bachelor’s degree in Electrical, Mechanical, Automation, or Materials Engineering with 5+ years of relevant experience;

or • Master’s degree in the above disciplines with 3+ years of experience.

Additional Information

All your information will be kept confidential according to EEO guidelines.

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