Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
We are seeking a Mechanical Engineer to join our team, specializing in mechanical simulations for semiconductor packages. The ideal candidate will have a background in predicting stress and mechanical behavior across various layers of both advanced 2.5D and standard semiconductor packages. You will be a part of a high-impact high-visibility team, and you will learn about all aspects of AI hardware development, from architecture to design to manufacturing, to reliability.
This role is hybrid, based out of Toronto, ON.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who you are
- You hold a degree in Mechanical Engineering, Materials Science, or a related field and have experience in semiconductor package simulation.
- You bring strong expertise in stress analysis, thermal behavior, and mechanical modeling for complex package structures.
- You are proficient with FEA tools such as ANSYS, Abaqus, or similar platforms, with a solid foundation in core mechanical engineering principles.
- You work independently, build models from scratch, gather input across teams, and communicate technical findings clearly to stakeholders.
What we need
- Perform mechanical simulations to predict stress, strain, and thermal behavior across semiconductor packages, including ELK layer, ubump, bump, C4 bump, and BGA.
- Conduct warpage prediction and mechanical optimization to improve manufacturability, reliability, and overall package performance.
- Analyze and validate multiple package design options under a range of operating conditions using robust simulation models.
- Collaborate with design, process, and reliability teams while documenting and presenting simulation results to stakeholders.
What you will learn
- You will gain exposure to the full AI hardware development lifecycle, from architecture and design through manufacturing and reliability.
- You will deepen your understanding of advanced semiconductor packaging technologies, including 2.5D integration.
- You will see how simulation directly shapes package design decisions, product performance, and readiness for production.
- You will broaden your perspective by working cross-functionally with experts across packaging, design, process, and reliability.
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.
Other open roles at Tenstorrent(6)
Tenstorrent is a next-generation computing company that builds computers for AI. Headquartered in the U.S. with offices in Austin, Texas, and Silicon Valley, and global offices in Toronto, Belgrade, Seoul, Tokyo, and Bangalore, Tenstorrent brings together experts in the field of computer architecture, ASIC design, RISC-V technology, advanced systems, and neural network compilers.
Key team members
Chip Kerchner
Steve Miller
Jonathan Baker
Bill Greene
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