• Define and implement end-to-end DFT architecture and strategy for complex SoC designs, including scan, MBIST, BIST, and JTAG/IEEE 1149.x
• Insert and verify scan chains, compression logic, and test wrappers using industry-standard DFT tools
• Own the full ATPG lifecycle: verification, coverage analysis, pattern generation, and ATE bring-up
• Perform fault simulation and analyze test coverage metrics to meet manufacturing test requirements
• Collaborate with physical design teams to optimize scan chain ordering, routing, and test timing
• Define and implement memory BIST (MBIST) and logic BIST (LBIST) strategies for embedded memories
• Work with ATE teams to develop test programs and validate tester compatibility
• Develop DFT automation scripts and integrate DFT flows into the overall design implementation flow
• Perform DFT sign-off verification and resolve DRC/functional issues related to DFT logic
• Document DFT specifications, methodology guidelines, and test coverage reports
### WHAT YOU BRING TO THIS ROLE:• MS/PhD or equivalent experience in Electrical Engineering or a related field
• Minimum 8+ years of hands-on experience in Design-for-Test (DFT) for complex digital ASICs or SoCs
• Hands-on experience with industry-standard DFT tools such as Synopsys DFT Compiler, Tessent, or equivalent
• Strong expertise in scan insertion, ATPG pattern generation (stuck-at, transition, IDDQ), and fault simulation
• Experience with compression architectures (EDT, DFTMAX) and advanced DFT techniques
• Working knowledge of MBIST architectures and embedded memory test strategies
• Familiarity with JTAG/IEEE 1149.1, IEEE 1500, and IEEE 1687 (iJTAG) standards
• Proficiency in scripting (Tcl, Python, Perl) for DFT flow automation and analysis
• Experience collaborating with physical design and STA teams for scan chain closure
• Strong understanding of digital design fundamentals and RTL design practices
• Passion for mentoring engineers and scaling technical excellence across a team
### BONUS POINTS:• Experience with IEEE P1838 (3D-IC test standards) or die-to-die interface test
• Exposure to at-speed test methodologies, on-chip clock control for at-speed test, and diagnosis flows for yield improvement
• Experience with system-level test and in-system test (IST) approaches
• Familiarity with ATE platforms (Advantest, Teradyne) and test program development
• Expertise in using programming languages and AI tools for test flow automation
• Background in satellite communication, 5G NR, or IoT SoC designs
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