Failure Analysis Engineer (Starshield)

FAILURE ANALYSIS ENGINEER (STARSHIELD) 

Starshield leverages SpaceX’s Starlink technology and launch capability to support national security efforts. While Starlink is designed for consumer and commercial use, Starshield is designed for government use, with an initial focus on earth observation, communications, and hosted payloads.

The Failure Analysis Engineer will interface with PCBA production, Supplier Development, Reliability, and EEE Piece Part groups. Familiarity with SMT manufacturing, EEE piece parts, and failure analysis equipment for both destructive and non-destructive analysis is required. Working directly in the Failure Analysis laboratory, this position will support the analysis of failures observed in production, determine the quality of the manufacturing process, and support investigations into nonconforming product.  The goal of the team is to support this analysis through all phases of product life-cycles, including build and test of pre-production, qualification, and flight hardware, as well as supporting existing production lines.  The ideal candidate is highly skilled in mechanical and electrical disciplines, hands-on, flexible, a quick learner, works well in a fast-paced environment, and possesses a can-do attitude.

RESPONSIBILITIES:

• Support destructive and non-destructive analyses during development and pre-production phases of hardware life-cycles, including pre-production, qualification, and flight hardware
• Support engineering in analysis of rework and recovery efforts on non-conforming hardware
• Assist with analyses into piece part failures, as well as non-conforming material
• Support efforts on First Article Inspection Reports
• Provide targeted surge support for company critical analyses or qualification test efforts

BASIC QUALIFICATIONS:

• Bachelor's degree in material science, electrical engineering, physics, or other STEM discipline
• 1+ years of experience in semiconductor, package, and/or PCBA reliability
• 1+ years of work experience failure analysis on semiconductor packages and devices

PREFERRED SKILLS AND EXPERIENCE:

• Master's degree in material science or advanced degree in a related field
• Experience with non-destructive analysis techniques such as Visual Inspection, X-Ray, CT scan, SEM, CSAM, curve tracing, etc.
• Experience with destructive analysis techniques such as Cross Section, Parallel Lapping and Polishing, dye and pry, and chemical decapsulation
• Experience with semiconductor analysis techniques OBIRCH, photo emission analysis, thermal emission analysis, etc.
• Understanding of basic electronic theory
• Experience in electrical troubleshooting
• Ability to work independently and problem solve efficiently with minimal supervision
• Ability to stay organized with strong attention to detail
• Proficient with Microsoft Excel, Word, and PowerPoint

ADDITIONAL REQUIREMENTS:

• Must be able to lift 25 lbs. unassisted
• Must be comfortable working in tight spaces
• Must be comfortable using power tools like saws and sanders
• Must be comfortable using hand tools like awls, hammers, or shears
• Must be comfortable in handling corrosive chemicals using proper PPE
• Must be able to move repetitively, bend or twist, and use hands to handle, control, or feel objects, tools or controls
• Ability to work overtime and weekends as needed