Package Design Engineer, Sr Staff

General Information

Job Title Package Design Engineer, Sr Staff Job ID 13000 Country Taiwan City Hsinchu Date Posted 20-Oct-2025 Job Category Engineering Job Subcategory Hardware Engineering Hire Type Employee Remote Eligible No

Descriptions & Requirements

Job Description and Requirements

We Are:At Synopsys, We Drive The Innovations That Shape The Way We Live And Connect. Our Technology Is Central To The Era Of Pervasive Intelligence, From Self-Driving Cars To Learning Machines. We Lead In Chip Design, Verification, And Ip Integration, Empowering The Creation Of High-Performance Silicon Chips And Software Content. Join Us To Transform The Future Through Continuous Technological Innovation.

You Are:

You are a seasoned package design engineer passionate about advancing semiconductor technology and delivering best-in-class solutions for high-performance silicon chips. With over a decade of hands-on experience in package design, you possess a deep understanding of electronic theory and the intricacies of substrate and PCB design. You thrive in dynamic, collaborative environments, leveraging your expertise to solve complex technical challenges and drive projects forward. Your quick-learning attitude and proactive approach enable you to stay ahead of industry trends and adapt to evolving technologies. Clear communication—both written and verbal—is one of your strengths, allowing you to effectively share insights with global teams and customers. You take pride in guiding clients to optimal solutions and are motivated by continuous personal and professional growth. You value working in an inclusive environment where diverse perspectives foster innovation. If you’re ready to make a significant impact alongside some of the industry’s brightest minds, Synopsys is the place to elevate your career.

What You’Ll Be Doing:

• Collaborating during early design stages to optimize and define requirements for SIPI performance, such as bump maps.
• Supporting the design and development of over 25 PHY Test Chip Packages annually, ensuring robust performance and reliability.
• Assisting customers in evaluating and selecting the most suitable package solution options for Synopsys IPs.
• Modeling and analyzing package substrates and PCB designs using advanced tools to verify and enhance performance.
• Coordinating multiple phases of the package design process and managing workflow for efficient project execution.
• Resolving a wide range of technical challenges with creative problem-solving and innovative engineering approaches.
• Providing regular project status updates to management and key stakeholders.
• Representing Synopsys in cross-functional projects with various business units and global teams.

The Impact You Will Have:

• Drive the successful delivery of high-performance test chip packages, directly contributing to Synopsys’ industry leadership.
• Empower customers to make informed package solution choices, enhancing the value and adoption of Synopsys IPs.
• Elevate product reliability and performance through rigorous modeling, analysis, and design optimization.
• Streamline design workflows and improve project efficiency across multiple package development cycles.
• Foster innovation by solving complex engineering challenges and implementing cutting-edge solutions.
• Enhance cross-functional collaboration and knowledge sharing within a diverse, global organization.
• Strengthen Synopsys’ reputation for technical excellence and customer-centric support in the semiconductor industry.

What You’Ll Need:

• Minimum of 10 years’ experience in package design engineering, preferably in semiconductor or high-tech environments.
• Advanced knowledge of circuit and transmission line theory, with proven application in package and PCB design.
• Hands-on experience with 3D electromagnetic modeling tools such as HFSS or equivalent.
• Proficiency in both Windows and Linux operating systems for simulation and design tasks.
• Excellent verbal and written communication skills in English, enabling effective collaboration and reporting.
• Bachelor’s degree in Electrical or Electronic Engineering or equivalent qualification.

Who You Are:

• Detail-oriented, analytical, and committed to excellence in technical execution.
• Proactive self-starter with a drive to learn and adapt to new technologies.
• Collaborative team player who values diverse perspectives and open communication.
• Creative problem-solver with a solutions-oriented mindset.
• Effective communicator who can translate complex concepts for both technical and non-technical audiences.
• Resilient under pressure, able to manage multiple projects and deadlines efficiently.

The Team You’Ll Be A Part Of:

Join a dynamic, global team of highly skilled professionals dedicated to innovation in semiconductor packaging and IP integration. You’ll work alongside experts in electronic design, collaborating across business units and geographies to deliver world-class solutions. Our team fosters a culture of support, continuous learning, and shared success, making Synopsys an inspiring place to grow your career.

At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.