Senior Process Engineer(Die Attach)

About The Role

As a Senior Process Engineer (Die Attach), you will be responsible for developing, improving, and sustaining die attach processes to support both new product introductions and existing production lines. This role requires a strong technical background, hands-on process expertise, and the ability to lead cross-functional discussions to ensure robust manufacturability, reliability, and continuous improvement of assembly processes.

What You Will Do

• Develop and sustain die attach processes for new and existing products.
• Ensure effective technical communication and information flow within the project team, guiding discussions on die attach topics.
• Provide technical input for assembly process and equipment solutions for assigned new products or platforms.
• Deliver technical solutions from development to high-volume manufacturing to ensure robust package manufacturability and reliability.
• Offer technical support on die attach topics to both internal and external customers.
• Demonstrate technical leadership and drive process challenges with cross-site collaboration.
• Conduct failure analysis and root cause investigations for die attach-related failures.
• Prepare technical reports, process documentation, and training materials for production support.
• Support audits and customer visits with technical data and process explanations.
• Degree in Engineering or a related discipline.
• Provide technical input for assembly process and equipment solutions for assigned new products or platforms.
• Deliver technical solutions from development to high-volume manufacturing to ensure robust package manufacturability and reliability.
• Offer technical support on die attach topics to both internal and external customers.
• Demonstrate technical leadership and drive process challenges with cross-site collaboration.
• Conduct failure analysis and root cause investigations for die attach-related failures.
• Prepare technical reports, process documentation, and training materials for production support.
• Support audits and customer visits with technical data and process explanations.
• Degree in Engineering or a related discipline.

What You Will Need

• Minimum five (5) years of relevant experience in a manufacturing environment, preferably within the semiconductor industry.
• Strong knowledge of Front-of-Line (FOL) assembly processes such as die bond, wire bond, and AOI.
• Familiarity with Six Sigma, FMEA, DOE, and statistical analysis.
• Experience with wire-bonded and clip-bonded packages.
• Strong knowledge of Front-of-Line (FOL) assembly processes such as die bond, wire bond, and AOI.
• Familiarity with Six Sigma, FMEA, DOE, and statistical analysis.
• Experience with wire-bonded and clip-bonded packages.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.