External Manufacturing NPI Engineer

Job Summary:

We are looking for a skilled NPI Engineer to join our External Manufacturing team with a focus on wafer-level packaging (WLP) and post-foundry solutions. In this role, you will leverage your strong expertise and extensive technical network to develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and WLP solutions. 

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch with a focus on wafer-level packaging (WLP) and post-fab solutions   
• Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release       
• Drive DFM, technology & manufacturability readiness for new product/ package development, effective POR freeze for new product introduction 
• Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include BOM & process setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release 
• Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
• Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
• Adoption of data analytics and data-driven approach to problem solving and decision making
• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production 
• Participate in quality and process readiness audit to achieve production site readiness
• Co-work with operations to drive continuous yield improvement for evolving challenges 
• Subject Matter Expert to address arising package and assembly challenges
• Experienced candidate(s) will be considered for lead role to manage team activities
• Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
• More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience 
• Hands-on experience in wafer-level packaging (WLP) and post-fab solutions including electroless & electrolytic plating and other surface finishing technology
• Familiar with plating chemistry/ process and material/ metallurgy characterization & microstructural analysis    
• Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
• Experience in IC package design/ CAD/ FEA simulation/ characterization will be advantageous
• Good overall understanding of OSAT business landscape and operations
• Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
• Strong project management skills and multi-stakeholder management 
• Proficient in statistical analysis methods and familiar with data analytics  

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits