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Molding Equipment Engineer

NXP Semiconductors.com

Office

Kaohsiung, Taiwan

Full Time

Job Description

  • Responsible for Assembling Back-End - Molding Equipment.
  • Machine Improvement. (Ou/Mtba/Productivity).

  • Spare parts management, cost reduction.
  • Mold Tool Management.

  • SOP definition, SOP compliance, machine standardization.
  • Automation Project.

Requirements

  • Bachelor degree and above. Major in Mechanical and Automation Engineering related fields.
  • Proactive mind, curiosity and want to learn communication skills by using English.
  • Familiar With Autocad.

  • Having experience with equipment maintenance or improvement is a plus.
  • Having experience with mold tool design or maintenance is a plus.
  • Having experience with equipment automation is a plus.


More information about NXP in Greater China...

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Molding Equipment Engineer

Office

Kaohsiung, Taiwan

Full Time

October 10, 2025

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NXP Semiconductors

NXP