Technical Support Engineer (TSE) III - SRP - (E3)

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

Location:

Austin,TX, Boise,ID, Bundang,KOR, Hillsboro,OR, Hiroshima,JPN, Hsinchu,TWN, Hwaseong-Castle,KOR, Icheon-Godam,KOR, Kaohsiung,TWN, Kumamoto,JPN, Lehi,UT, Linkou,TWN, Manassas,VA, Phoenix,AZ, Pyeongtaek-Mokok,KOR, Santa Clara,CA, Singapore,SGP, Taichung,TWN, Tainan,TWN, Yokkaichi,JPN

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Technical Support Engineer (TSE)

TSEs provide technical support remotely, and on site, to FSO personnel for highly complex problems involving equipment malfunction, on wafer issues, and performance enhancement programs where first-line product support was unable to isolate or fix a problem. Using advanced troubleshooting methodologies, they establish success criteria, develop comprehensive action plans, analyze and compile findings, perform root cause analysis and support FSO repair activities through escalation closure.

• Support multiple technical escalations, resolve with focus on time to resolution and quality of work
• Attend customer field issues meetings with FSO, collaborate with BU engineers
• Recommend best practices to improve products, processes, or services.
• Publishing Technical Lessons Learned, troubleshooting guides, technical (ET) papers, etc.
• Provide on-site coaching to FSO  
• Provide Alpha and Beta Site support
• Support NPI development early in the product life cycle, and at key customer sites
• Support BU DFx (Design for Service / Install) projects
• Create, or collaborate in creation of, innovative advanced trouble shooting tools  

Business Expertise:

Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market.

Leadership:

Provides coaching to colleagues with less experience; may lead small projects with manageable risks and resource requirements.

Problem Solving:

Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information and data.

Impact:

Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies.

Interpersonal Skills:

Explains difficult or sensitive information; works to build consensus. Manage difficult situations in stressful environments.

Qualifications

• Skills:

• Years of Experience: 3+ years of experience with Applied Materials SRP products or similar semiconductor equipment.
• Education: Bachelor’s degree or equivalent in technical field  
• Ability to work independently and as part of a team
• Strong organizational and time management skills
• Excellent interpersonal and communication skills
• Ability to handle stressful situations and effectively manage difficult problems
• Familiar with suite of Microsoft Apps, and internal ones such as SAP, VSPI, and ARK
• Certifications: Applied Materials Etch Product Certification or equivalent.
• Languages: English (written and verbal)
• Work Experience: Minimum 3 years of semiconductor fab HW experience
• Shift: Mon-Fri 8 hr per day
• Travel: Yes, generally 25% of the time, but could be as high as 50%.
• Relocation Eligible: No

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 25% of the Time

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.