Sr. Principal Foundry Engineer - HV/BCD Device Expert

Description:    APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP.    The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI), and within foundry process transfers and new fab enablement

The key areas of responsibility of the jobholder are:
-    Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process
-    Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement.
-    Interface with key customers on critical projects.
-    Lead and steer the projects towards timely completion to support NXP business needs
-    Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc
-    NTI Process transfers within foundry and with any NXP joint ventures
    
Requirements / preferences:    

-    Bachelor or MSc in physics or electrical engineering.
-    >10 years of experience with front-end IC process integration, working in foundries’ production or development teams
-    In-depth knowledge of HV/BCD devices and processes
-    Strong understanding of yield enhancement techniques and data analysis
-    Must be fluent in English and Mandarin
-    Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up.
-    Good communication skills. Having the ability to influence and steer a discussion
-    Pro-active working attitude, creative, pragmatic, enterprising and result driven.
-    Familiar in managing/working with foundries, maximising leverage from foundries 
 

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