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Senior R&D Package design Engineer

onsemi.com

Office

Zhubei, Hsinchu County, Taiwan

Full Time

Lead imager package product design activities including: schematic and package netlist definition; package circuit layout; package simulations; package design review and approval; and package product performance verification.

Provide direct design support for imager package product designs including wire bond BGA/LGA/PGA, MCP (multichip package), flip chip package and WLCSP (wafer level chip scale package).

Work directly with Product Design, Design Integration, Product Engineering, Test Engineering, Applications Engineering, Hardware Development, Marketing, Packaging R&D, Packaging NPD, Purchasing, OSAT’s, and key package material suppliers.

Bachelor or master degree in Electrical Engineering, Mechanical Engineering, or Engineering related.

8+ years experience in package and/or hardware system design, assembly process engineering, and new product development.

Package/PCB layout experience using Cadence APD/SIP required.

Signal/Power/Ground integrity experience and familiarity with simulation tools such as Cadence Sigrity Package Assessment, ANSYS Q3D, and ANSYS HFSS.

Mechanical design experience using AutoCad and Solid Works.

Solid understanding of packaging assembly process and material properties.

Experience with thermal and mechanical stress simulation using finite element analysis. 

Strong project management and problem solving skills required.

Able to work independently and interact with multinational team members.

Bilingual in English and Mandarin Chinese.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

Senior R&D Package design Engineer

Office

Zhubei, Hsinchu County, Taiwan

Full Time

September 30, 2025

company logo

onsemi

onsemi