Packaging Module Development Manager

Job Details:

Job Description:

Seeking a highly motivated, self-driven individual in ATD-Asia with strong technical background and ability to collaborate well across multi-functional teams driving materials technology development in packaging.

• Candidate will be responsible for leading efforts to develop, integrate, and certify materials in support of assembly packaging development & HVM readiness for Intel’s Packaging Technologies.
• Candidate will be expected to communicate and influence materials and supplier directions, strategies, and decisions. 
• The candidate should have a solid understanding of the fundamentals of materials (polymers, metals, solders, composites, etc.), physical and mechanical properties, structure-property-processing relationships, analytical tools and characterization techniques, mechanical behavior and modeling, thermodynamics and kinetics, and phase transformations, etc.
• Candidate must be able to apply sound technical problem solving skills in resolving materials-process-equipment issues in technology development.
• Specific responsibilities include planning and executing programs for evaluating new material and supplier technologies, conducting material/supplier technology assessments, and making material/supplier technology recommendations/certifications to platform programs.
• Candidate is expected to work in close collaboration with MTD and ME teams in ATD  along with Global materials, Core competency, Q&R, and Technology Integration partners.
• Candidate must be able to work with external materials suppliers, should possess effective communication and presentation skills with ability to formulate and present materials strategies and development plans in internal and external forums. Demonstrated project and team management skills, communication and presentation skills, negotiation skills, and well developed influencing skills are a must. Travel to materials, suppliers, and assembly sites is required.

Qualifications:

• Candidates must have a Ph.D. degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Science and Engineering, or Metallurgy with excellent understanding of materials characterization tools and techniques.
• Strong understanding of Packaging assembly materials-porcess-equipment integration, materials supplier management is highly desired.
• Effective communication skills with ability to closely collaborate across multiple teams and sites is required.
• Knowledge of statistical methods, Design of Experiments knowledge is a strong plus.

Job Type:

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Additional Locations:

Malaysia, Penang

Business Group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position Of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.