Equipment Engineer (Wirebond)

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🌟 Hiring: Equipment Engineer (Wirebond) – Malaysia (Client Location) | New Era Technology 🌟

• Client Location: Telok Panglima Garang (FIZ), Kuala Langat, Selangor Darul Ehsan, Malaysia
• Company: New Era Technology – www.neweratech.com
• Work Type: Perm

🚀 About The Role:

New Era Technology is looking for experienced Equipment Engineer (Wirebond) to be deployed at our prestigious client in Malaysia at their Selangor office.

🛠️ Key Responsibilities:

• Define and manage machine specifications, including purchase order (PO) controls and buy-off procedures.
• Set up and qualify new and existing wire bond equipment to meet production and quality standards.
• Develop and implement machine maintenance specifications and ensure execution of routine and breakdown maintenance.
• Troubleshoot and resolve equipment-related quality issues promptly.
• Sustain equipment performance, including MTBA/MTBF, and ensure optimal machine and process setup for existing products.
• Drive capability improvements, cost reduction, parameter optimization, and technical documentation.
• Lead technical skill development and training for equipment and production personnel.
• Plan and support initiatives to enhance process productivity and efficiency.
• Conduct effective root cause analysis using industry best practices.
• Manage maverick lots and ensure proper lot disposition.
• Maintain and control in-process documentation and systems.
• Deliver machine-related training programs to upskill team members.
• Communicate effectively with customers on equipment and process-related matters.
• Support new product introductions and scale-up from low to high volume manufacturing.
• Coordinate and support internal and external audits.
• Foster a culture of innovation and continuous improvement.

🎓 Qualification & Experience:

• Bachelor’s or Master’s degree in Engineering (Electronics, Electrical, Mechanical, Mechatronics, Materials, or Manufacturing Engineering).
• Minimum 3 years of hands-on experience in semiconductor assembly, specifically in wire bond equipment and processes.
• Strong technical knowledge of semiconductor manufacturing processes: die sawing, die attach, clip bond, encapsulation, trim & form, marking, testing, and packing.
• Proficient in wire bond machine maintenance, including routine alarms and breakdown recovery.
• Experience in transitioning products from low to high volume manufacturing.
• Familiarity with Power devices, QFN packages, and Flip Chip assembly is a plus.
• Solid understanding of ISO and IATF automotive standards.
• Skilled in quality tools and methodologies: FMEA, DOE, statistical analysis, 8D, 5S, Six Sigma.
• Strong project management, organizational, and interpersonal skills.
• Excellent communication skills—able to present technical concepts confidently to teams and executives.
• Self-motivated, independent, and capable of working with minimal supervision.

Applicants must be willing to work in Telok Panglima Garang (FIZ), Selangor

👤 Preferred Candidate:

• Nationality: Open for Malaysians only
• Availability: Candidates who can join max in 30-45 days.
• 📧 How to Apply:
• Send your updated resume to Nithiya.murali@neweratech.com with the subject line:
• “Equipment Engineer (Wirebond)-Malaysia”

🔗 About Us:
New Era Technology (www.neweratech.com) is a global IT services provider with a footprint in 80+ countries, delivering cutting-edge digital transformation, consulting, and staffing services across industries

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