Staff Manufacturing Engineer, Modularized Data Center Assembly

Minimum Qualifications:

• Bachelor's degree in Engineering or a related technical field or equivalent practical experience.
• 10 years of experience in Manufacturing engineering/Industrial engineering and working on assembly processes.

Preferred Qualifications:

• Master's degree or PhD in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
• 5 years of experience in manufacturing engineering leading low or high volume assemblies or equivalent experience.
• Experience in working in automotive, battery, or other electromechanical assembly lines.
• Experience in infrastructure projects, especially Data Center facility and product designs.
• Experience in electrical, mechanical, or industrial engineering.

About The Job

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

Google is revolutionizing the construction of hyperscale data centers, moving from traditional, multi-year, custom-built monoliths to a more agile approach of manufactured, modular, and just-in-time deployments. The Data Center Technology Solutions (DCTS) team is at the forefront of this transformation, driving innovation and efficiency across the design, engineering, manufacturing, and execution of these next-generation data centers.

A core component of DCTS, the manufacturing function is tasked with developing the designs, robotics, processes, and systems necessary to facilitate this shift from conventional construction to a manufactured and just-in-time deployment model. This team collaborates extensively across Google Data Centers (GDC) and the broader Artificial Intelligence and Informatics (AI&I) organization. Their primary responsibility is to oversee the design and delivery of internally assembled and tested modular data centers, which will provide the essential capacity for all of Google's future needs.

The US base salary range for this full-time position is $165,000-$245,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Be responsible and own manufacturing engineering of complex assembly manufacturing of modular data center equipments.
• Work cross functionally across platforms, hardware operations, chip diagnostics and data center system design engineers to develop and define manufacturing capacity calculations, as well as central operations and logistics to formulate a comprehensive material flow, delivery, and associated systems plan.
• Develop and validate comprehensive test plans and tooling fixtures for manufacturing processes, including electromechanical, networking, and chip-level components.
• Support process failure mode and effects analysis (PFMEA). Partner with cross-functional teams to conduct root cause analysis and implement corrective actions for incoming quality issues.
• Own and drive manufacturing process flows for all manufacturing assembly needs electrical, mechanical and networking assemblies and cross-functionally integration. Take ownership of design for manufacturing principles and test plans throughout the upstream supply chain.