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Wire Bond Process Engineer

ams OSRAM

Office

Bayan Lepas, MY, 11900

Full Time


 

Sense the power of light

ams OSRAM is a global leader in innovative light and sensor solutions. “Sense the power of light” – our success is based on our deep understanding of the potential of light. By adding intelligence to light, we enable our customers to drive transformative applications. Our around 20,000 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Whatever your role is, you are a part of a talented team that enjoys exploring and designing new technologies.

 

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Your new responsibilities

  • Responsible for line sustaining issues & full accountability of outgoing yield and quality of Wire Bond process. KPIV, KPOV & LoD are key. Updating documentation on a timely manner (FMEA, WI, POCAP, CP, Build sheet…etc)
  • Hands on & run the equipment/process in production mode. Expected to spend time on the production floor daily
  • Equip with wire bond process knowledge through self-learning and able to do some minor troubleshooting whenever there are any quality/maverick issues occur
  • Work closely with cross functional team like equipment, PO & Quality team on any issues arise
  • Work closely with R&D for new product development to ensure robust process & manufacturability. Support new product pre-series and ramp-up
  • Initiate cost & yield improvement projects which may need to drive the upstream process on any incoming quality deviations


What we look for


  • Min Bachelor's Degree in Electrical / Electronics / Mechanical Engineering or equivalent
  • Preferred with min 8 years working experience in High Volume Manufacturing and Complex process for IC or LED manufacturing
  • Experience in the Wire Bond process is highly preferred
  • 6 Sigma Methodology, Green/Black Belt is an advantage
  • Process control knowledge-Control Plan, FMEA, SPC, MSA, 8D, DOE, Minitab, PBI
  • Proficient speaking & writing in English


Please contact Shin Yih Cheah for further information via SHIN-YIH.CHEAH@AMS-OSRAM.COM or +6043053333.

Wire Bond Process Engineer

Office

Bayan Lepas, MY, 11900

Full Time

September 4, 2025

company logo

ams OSRAM

amsOSRAM