Lead Semiconductor Packaging Engineer - 392
Quantinuum
Office
US Plymouth, MN
Full Time
We are seeking a Lead Semiconductor Packaging Engineer in our Plymouth, MN Location. All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test.
Key Responsibilities:
- Develop and implement advanced packaging concepts for tiling large assemblies of ion trap chips, electrical chips and optical chips together
- Develop and implement advanced packaging concepts for mechanical, thermal, electrical, optical, and detection interfaces to next-generation ion traps
- Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density
- Work with vendors to implement and validate packaging processes
- Support all stages of ion trap development to ensure compatibility with packaging
- Interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
- Engage with 3rd parties to cultivate key partnerships, supplier relationships, and co-development opportunities
YOU MUST HAVE:
- PhD
- Minimum 7 years’ experience in advanced semiconductor packaging development
- Due to Contractual requirements, must be a U.S. Person. defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status
- Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.
WE VALUE:
- PhD in Physics or Engineering
- 7 years’ experience with advanced large area multi-chip semiconductor packaging technologies
- 5 years’ experience with large heterogeneous integration and 2.5-3D packaging techniques
- 5 years’ experience with high-density I/O technologies
- Experience with photonic packaging and fiber-to-chip or optical chip to optical chip coupling is a plus
- A proven track record of innovation and IP development
- Experience working within a cross-functional team environment
Lead Semiconductor Packaging Engineer - 392
Office
US Plymouth, MN
Full Time
August 25, 2025